1. Yamaguchi K. (2001) J. Appl. Phys. 89:590
2. P. Walker, H. Mizuta, S. Uno, and Y. Furuta, 2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices (Piscataway, NJ: IEEE, 2003), pp.␣207–210.
3. G. Steinlesberger, M. Engelhardt, G. Schindler, W. Steinhogl, M. Traving, W. Honlein, and E. Bertagnolli, Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (Warrendale, PA: Mater. Res. Soc., 2003), pp. 379–384.
4. S. Shojaei-Zadeh, S. Zhang, W. Liu, Y. Yang, S.M. Sadeghipour, M. Asheghi, and P. Sverdrup, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, vol. 2 (Piscataway, NJ: IEEE, 2004), pp. 575–583.
5. E.O. Hall, Proceedings of the Physical Society. Section B, vol.␣64, p. 742, 1951.