Author:
Chung Chang-Kyu,Kwon Yong-Min,Kim Il,Son Ho-Young,Choo Kyo-Sung,Kim Sung-Jin,Paik Kyung-Wook
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. J. Liu, Conductive Adhesive for Electronics Packaging, Electrochemical Publications Ltd., Port Erin, 12–13 (1999)
2. W.S. Kwon, S.J. Ham, M.J. Yim, S.B. Lee, K.W. Paik, J. Electron Packaging 127, 86 (2005) doi: 10.1115/1.1846062
3. S. Ganesan, M. Pecht, Lead-free Electronics, John Wiley & Sons, New Jersey, 437 (2006)
4. W.S. Kwon, K.W. Paik, Int. J. Adhes. Adhes. 24, 135 (2004) doi: 10.1016/j.ijadhadh.2003.07.003
5. M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, A. Sharif, Solder. Surf. Mt. Tech. 17, 40 (2005) doi: 10.1108/09540910510597492
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