Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing-Reference-Cited by-同舟云学术

Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing

Published:2001-07 Issue:7 Volume:30 Page:878-884
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Young Bi-Lian,Duh Jenq-Gong

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0075-2.pdf

Reference11 articles.

1. T.A. Powers, T.J. Singler, and J.A. Clum, J. Electron. Mater. 23, 773 (1994)

2. R.B. Cinque and J.W. Morris, Jr., J. Electron. Mater. 23, 533 (1994).

3. D.R. Frear, F.M. Hosking, and P.T. Vianco, Proc. Materials Developments in Microelectronic Packaging Conf. (Materials Park, OH: ASM, 1991), p. 229.

4. H.D. Blair, T.Y. Pan, and J.M. Nicholson, Proc. Electronic Component and Technol. Conf. (Piscataway, NJ: IEEE, 1998), p. 259.

5. C.Y. Lee and K.L. Lin, Thin Solid Films 249, 201 (1994).

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