Ag and Cu migration phenomena on wire-bonding

Author:

Hsieh Ker-Chang,Martens Theo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Review of Silver Wire Bonding Techniques;Micromachines;2023-11-20

2. Reliability and Failure of Microelectronic Materials;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

3. Package Material Selection Criteria for High Temperature Automotive Applications;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

4. Feasibility and characterization study of Al and Au wire bonding on immersion Ag and Sn coatings;Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)

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