1. K. Minami, T. Moriuchi, and M. Esashi, Technical Digest, Int. Conf. on Solid-State Sensors and Actuators (Transducers ’95) (Stockholm, Sweden, 1995), p. 240.
2. S. Mack, H. Baumann, and U. Gösele, Proceedings of the IEEE Workshop on Micro Electro Mechanical Systems (Nagoya, Japan, 1997), p. 488.
3. Y. Jin, Z.F. Wang, P.C. Lim, D.Y. Pan, J. Wei, and C.K. Wong, The 5th Electronics Packaging Technology Conference (EPTC 2003) (Singapore, 2003), p. 301.
4. I. Perez-Quintana, G. Ottaviani, R. Tonini, L. Felisaril, M. Garavaglia, L. Oggioni, and D. Morin, Phys. Status Solidi C 10, 3706 (2005).
5. B. Vu and P.M. Zavracky, J. Vac. Sci. Technol. B 14, 2588 (1996).