Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements-Reference-Cited by-同舟云学术

Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements

Published:2009-10-06 Issue:1 Volume:39 Page:105-108
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Leodolter-Dworak Monika,Steffan Ilse,Plumbridge William J.,Ipser Herbert

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0958-1.pdf

Reference15 articles.

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2. See any text book on Inorganic Chemistry, e.g., N. Wiberg, Hollemann-Wiberg: Lehrbuch der Anorganischen Chemie, 102nd ed. (Berlin - New York: de Gruyter, 2007).

3. P. Villard and L.D. Calvert, Pearson’s Handbook of Crystallographic Data for Intermetallic Phases, 2nd ed., Vol. 4 (Materials Park, OH: ASM International, 1991), p. 5285.

4. W.J. Plumbridge, J. Mater. Sci. Mater. Electron. 18, 307 (2007).

5. G. Tamman and K.L. Dreyer, Z. Anorg. Chem. 199, 97 (1931).

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