Tin pest issues in lead-free electronic solders-Reference-Cited by-同舟云学术

Tin pest issues in lead-free electronic solders

Published:2006-09-27 Issue:1-3 Volume:18 Page:307-318
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Plumbridge W. J.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-006-9025-3.pdf

Reference47 articles.

1. ‘Engineering the Future’, Open University Course, T173, Block 3, Part 5, ‘Lead-free solders’, (2001)

2. W.J. Plumbridge, R.J. Matela, A. Westwater, Structural Integrity and Reliability in the Electronics – Enhancing Performance in a Lead-Free Environment (Kluwer, Dordrecht, Boston, London, 2003) Chapter 1

3. M.R. Harrison, J.H. Vincent, H.A.H. Steen, Solder. Surf. M. Technol. 13, 21 (2001)

4. B. Richards, C.L. Levogner, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, Lead-Free Soldering – An Analysis of the Current Status of Lead-Free Soldering (Dept. Trade and Ind.,1999)

5. W.J. Plumbridge, C.R. Gagg, J. Mater. Sci.- Mater El. 10, 461 (1999)

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