First-Principles Study on the Structural, Elastic and Thermodynamic Properties of Binary Pd-Sn Compounds-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

First-Principles Study on the Structural, Elastic and Thermodynamic Properties of Binary Pd-Sn Compounds

Published:2022-12-22 Issue:3 Volume:52 Page:1875-1887
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Tian Yali^ORCID,Jia Guangyi,Wu Ping

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-10089-9.pdf

Reference43 articles.

1. J. Kim, S.B. Jung, and J.W. Yoon, Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn-58Bi solder joint. J. Alloys Compd. 820, 153396 (2020).

2. C.E. Ho, L.H. Hsu, C.H. Yang, T.C. Yeh, and P.T. Lee, Effect of Pd (P) thickness on the soldering reaction between Sn-3Ag-0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad. Thin Solid Films 584, 257 (2015).

3. Y.W. Yen, P.H. Tsai, Y.K. Fang, S.C. Lo, Y.P. Hsieh, and C.I. Lee, Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates. J. Alloys Compd. 503, 25 (2010).

4. J.W. Yoon, B.I. Noh, J.H. Yoon, H.B. Kang, and S.B. Jung, Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process. J. Alloys Compd. 509, 153 (2011).

5. K. Zeng, R. Stierman, D. Abbott, and M. Murtuza, The root cause of black pad failure of solder joints with electroless Ni/immersion gold plating. JOM 58, 75 (2006).

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hydrogen Storage Capacity of Lead-Free Perovskite NaMTH3 (MT=Sc, Ti, V): A DFT Study;International Journal of Energy Research;2024-02-28

2. A Dft Study of Structural, Electronic, Magnetic, Optical, Mechanical and Thermoelectric Properties of Novel Ti-Based Batix3 (X = Cl, Br, I) Halide Perovskites;2024

3. Ab initio insight into the physical properties of MgXH3 (X = Co, Cu, Ni) lead-free perovskite for hydrogen storage application;Environmental Science and Pollution Research;2023-10-19

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3