Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders-Reference-Cited by-同舟云学术

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Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders

Published:2016-08-22 Issue:1 Volume:46 Page:64-72
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Falakzaadeh F.,Mehryar R.^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4854-1.pdf

Reference11 articles.

1. D.J. Nelson and W.A. Sayers, Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM VIII., Eighth Annual IEEE (1992), pp. 62–68.

2. G.N. Ellison, IEEE Trans. Components Packag. Technol. (2003).

3. Y.S. Muzychka, M.M. Yovanovich, and J.R. Culham, 36th AIAA Thermophys. Conference, AIAA Paper 4187 (2003).

4. Y.S. Muzychka, J.R. Culham, and M.M. Yovanovich, 36th AIAA Thermophys. Conference, AIAA Paper 4188 (2003).

5. M.M. Yovanovich, Y.S. Muzychka, and J.R. Culham, J. Thermophys. Heat Transf. 13, 495 (1999).

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