Publisher
Springer Science and Business Media LLC
Subject
General Engineering,Condensed Matter Physics
Reference11 articles.
1. C. Santos, R. Prieto, P. Vivet, J. P. Colonna, P. Coudrain, and R. Reis, Graphite-based heat spreaders for hotspot mitigation in 3D ICs, Proc. Int. Conf. on the Integratio of 3D Systems (2015), pp. TS10.4.1–TS10.4.4.
2. B. Jiang, H. Wang, G. Wen, E. Wang, X.Fang, G. Liu, and W. Zhou, Copper–graphite–copper sandwich: Superior heat spreader with excellent heat-dissipation ability and good weldability, RSC Adv., 6, No. 30, Article ID 25128 (2016).
3. W. Fan, E. Galestien, C. Tomek, and S. Manjunath, Doubling the output of automotive LED headlight with efficient cooling using thermal pyrolytic graphite, Proc. 15th Int. Society Conf. on the Thermal and Thermomechanical Phenomena in Electronic Systems (2016), pp. 180–184.
4. D. Pinjala, N. Khan, X. Ling, P.-S. Teo, E. H. Wong, M. K. Iyer, C. Lee, and I. J. Rasiah, Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package, Proc. 52nd Conf. on Electronic Components and Technology, (2002), pp. 1119–1123.
5. R. Prieto, J. P. Colonna, P. Coudrain, C. Santos, P. Vivet, S. Cheramy, D. Campos, A. Farcy, and Y. Avenas, Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration, Proc. 31st Thermal Measurement, Modeling & Management Symp., United States (2015), pp. 221–227.