Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking-Reference-Cited by-同舟云学术

Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking

Published:2012-02-22 Issue:4 Volume:41 Page:720-729
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Murugesan M.,Ohara Y.,Fukushima T.,Tanaka T.,Koyanagi M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-1949-1.pdf

Reference28 articles.

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3. M. Murugesan J.C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W.C. Jeong, H. Kino, A. Noriki, K.W. Lee, T. Tanaka, and M. Koyanagi, Proceedings of 58th ECTC (2009), p. 1496.

4. L. Zhang, S. Ou, J. Huang, K.N. Tu, S. Gee, and L. Nguyen, Appl. Phys. Lett. 88, 012106 (2006).

5. M. Koyanagi, T. Fukushima, and T. Tanaka, Proc. IEEE 97, 49 (2009).

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