Processing and Deformation Behavior of Bulk Cu–Nb Nanolaminates
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys
Link
http://link.springer.com/content/pdf/10.1007/s13632-014-0172-2.pdf
Reference22 articles.
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3. S.J. Zheng, J.S. Carpenter, R.J. McCabe, I.J. Beyerlein, N.A. Mara. Engineering interface structures and thermal stabilities via SPD processing in bulk nanostructured metals. Sci. Rep. 4, (2014)
4. S. Zheng, I.J. Beyerlein, J.S. Carpenter, K. Kang, J. Wang, W. Han, N.A. Mara, High-strength and thermally stable bulk nanolayered composites due to twin-induced interfaces. Nat. Commun. 4, 1696 (2013)
5. S. Simões, R. Calinas, M.T. Vieira, M.F. Vieira, P.J. Ferreira, In situ TEM study of grain growth in nanocrystalline copper thin films. Nanotechnology 21(14), 145701 (2010)
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