Materials Informatics Approach to Cu/Nb Nanolaminate Microstructure Correlations with Yield Strength and Electrical Conductivity-Reference-Cited by-同舟云学术

Materials Informatics Approach to Cu/Nb Nanolaminate Microstructure Correlations with Yield Strength and Electrical Conductivity

Author:

Shiraiwa Takayuki¹,Yasuda Koki¹,Briffod Fabien¹,Jhon Mark²,Gunawan Fergyanto³,Sahay Rahul⁴⁵,Raghavan Nagarajan⁵,Budiman Arief S.³⁴⁶⁷,Enoki Manabu¹

Affiliation:

1. Department of Materials Engineering, School of Engineering, The University of Tokyo

2. Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A^*STAR)

3. Industrial Engineering Department, BINUS Graduate Program - Master of Industrial Engineering, Bina Nusantara University

4. Xtreme Materials Laboratory (XML), Engineering Product Development, Singapore University of Technology and Design (SUTD)

5. Nano-Micro Reliability Lab (MRL), Engineering Product Development, Singapore University of Technology and Design (SUTD)

6. Department of Manufacturing and Mechanical Engineering and Technology (MMET), Oregon Institute of Technology

7. Oregon Renewable Energy Center (OREC), Oregon Institute of Technology

Publisher

Japan Institute of Metals

Link

Reference47 articles.