Effect of N2 plasma treatment on the adhesion of Cu/Ni thin film to polyimide-Reference-Cited by-同舟云学术

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Effect of N2 plasma treatment on the adhesion of Cu/Ni thin film to polyimide

Published:2011-10 Issue:5 Volume:17 Page:789-795
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Woo Tae-Gyu,Park Il-Song,Jung Kwang-Hee,Jeon Woo-Yong,Seol Kyeong-Won

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s12540-011-1015-1.pdf

Reference23 articles.

1. T. G. Chung, Y. H. Kim, and J. G. Na, J. Kor. Inst. Met. & Mater. 29, 1097 (1991).

2. K. H. Hwang, K. I. Lee, S. K. Joo, and T. Kang, J. Kor. Associ. Cryst. Grow. 1, 80 (1991).

3. G. E. McGuire, Semiconductor Materials and Process Handbook, p. 587, Noyes Publication (1988).

4. B. S. Min, W. S. Chung, and I. G. Kim, J. Kor. Inst. Met. & Mater. 40, 12 (2002).

5. A. Ibanez and E. Fatas, Surf. Coat. Technol. 191, 7 (2005).

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