Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package-Reference-Cited by-同舟云学术

Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package

Published:2022-11-17 Issue:6 Volume:22 Page:2317-2325
ISSN:1547-7029
Container-title:Journal of Failure Analysis and Prevention
language:en
Short-container-title:J Fail. Anal. and Preven.

Author:

Supramaniam Saraswathy,Bakar Maria Abu,Jalar Azman

Publisher

Springer Science and Business Media LLC

Subject

Pharmacology

Link

https://link.springer.com/content/pdf/10.1007/s11668-022-01528-0.pdf

Reference22 articles.

1. G. Harman, Wirebonding in microelectronics, materials, processes, reliability and yield, 3 (Edn) (McGraw-Hill Professional, New York, 1997), p. 19–97

2. W. Wang, A. Choubey, M.H. Azarian, M. Pecht, An assessment of immersion silver surface finish for lead free electronics. J. Elect. Mater. 38, 815–827 (2009). https://doi.org/10.1007/s11664-009-0761-z

3. T.K. Lee, C.D. Breach, W.L. Chong, C.S. Goh Oxidation and corrosion of Au/Al and Cu/Al in wire bonding assembly. In: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. pp. 244–249 (2012). doi: https://doi.org/10.1109/ICEPT-HDP.2012.6474610.

4. C.-U. Kim and J.-Y. Chang Corrosion in a closed-loop electronic device cooling system with water as coolant and its detection. In: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). pp. 558–564 (2017). doi: https://doi.org/10.1109/ITHERM.2017.7992536.

5. Hualiang Huang, Bu. Furong, Correlations between the inhibition performances and the inhibitor structures of some azoles on the galvanic corrosion of copper coupled with silver in artificial seawater. Corros. Sci. 165, 108413 (2019). https://doi.org/10.1016/j.corsci.2019.108413

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