Interconnect Technology and Design for Gigascale Integration
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Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4615-0461-0.pdf
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon;IETE Journal of Research;2019-07-11
2. Thermally Aware Modeling and Performance Analysis of MLGNR as On-Chip VLSI Interconnect Material;Journal of Electronic Materials;2019-05-21
3. Performance analysis of doped multi-layer graphene nanoribbon (MLGNR) interconnects at deep sub-micron nodes;Proceedings of the Third International Conference on Advanced Informatics for Computing Research - ICAICR '19;2019
4. An Overview of the VLSI Interconnect Problem;Multi-Net Optimization of VLSI Interconnect;2014-10-16
5. Voltage Optimization of Power Delivery Networks through Power Bump and TSV Placement in 3D ICs;ETRI Journal;2014-08-01
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