Thermomechanics for Electronics Packaging-Reference-Cited by-同舟云学术

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Thermomechanics for Electronics Packaging

Published:1993 Issue: Volume: Page:1-77
ISSN:
Container-title:Thermal Stress and Strain in Microelectronics Packaging
language:
Short-container-title:

Author:

Lau John H.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-7767-2_1.pdf

Reference102 articles.

1. Chen, W. T., and C. W. Nelson, “Thermal Stresses in Bonded Joints,” IBM J. Research and Development, 23 (2), 1979, pp. 179–187.

2. Suhir, S., “Interfacial Stresses in Bimetal Thermostats,” ASME J. Applied Mechanics, 55, 1989, pp. 595–600.

3. Durelli, A. J., and C. H. Tsao, “Determination of Thermal Stresses in Three-Ply Laminates,” J. Applied Mechanics, Transactions of ASME, 77, 1955, pp. 190–192.

4. Evans, A. G., and J. W. Hutchinson, “On the Mechanics of Delamination and Spalling in Compressed Films,” Int. J. Solids and Structures, 20, 1984, 455–466.

5. Hu, S. M., “Film-Edge Induced Edge Stress in Substrates,” J. Applied Physics, 50 (7), 1979, pp. 4661–4666.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Front Matter;Practical Guide to the Packaging of Electronics;2016-07

2. Constitutive Properties of Pure Indium in Wide Temperature Range;Mechanics of Advanced Materials;2015

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