Fundamentals of Lead-Free Solder Interconnect Technology

Author:

Lee Tae-Kyu,Bieler Thomas R.,Kim Choong-Un,Ma Hongtao

Publisher

Springer US

Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys;Journal of Electronic Materials;2023-12-06

2. A high-performance Sn–Sb–Cu alloy processed by pressure heat treatment: microstructure, thermal and mechanical properties;Journal of Materials Science: Materials in Electronics;2023-08

3. The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys;Materials Characterization;2023-07

4. Size Effects on Overall Deformation Behavior of SAC Samples;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Influence of SAC0307-TiO2 Composite Solder Joint on Thermal Parameters of MOSFETs;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

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