1. IPC, ANSI/IPC-SF-818, “General Requirements for Electronic Soldering Fluxes,” Lincolnwood, IL: Institute for Interconnecting and Packaging Electronic Circuits (IPC), 1988.
2. Bellcore, TR-TSY-000078, Issue 2. “Generic Physical Design Requirements for Telecommunications Products and Equipment,” Red Bank, NJ: Bell Communications Research, Inc., 1988.
3. Guth, L. A., “Low Solids Flux Material Characterization Studies,” IPC Technical Paper IPC-TP-735, 1988.
4. Bellcore, TA-TSY-000078, Issue 2. “Proposed Revision of TR-TSY-000078: Generic Physical Design Requirements for Telecommunications Products and Equipment,” Red Bank, NJ: Bell Communications Research, Inc., 1987.
5. Printed Circuit World Convention III, WCIII70;FM Zado,1984