Advanced Soldering Processes-Reference-Cited by-同舟云学术

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Advanced Soldering Processes

Published:1993 Issue: Volume: Page:227-266
ISSN:
Container-title:The Mechanics of Solder Alloy Wetting and Spreading
language:
Short-container-title:

Author:

Jellison J. L.,Golden J.,Frear D. R.,Hosking F. M.,Keicher D. M.,Yost F. G.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-1440-0_8.pdf

Reference69 articles.

1. Antonevich, J. 1976. Welding J. July 1976. pp.200s–207s.

2. Ashkin, A., G. D. Boyd, and J. M. Dziedzic. 1966. IEEE J Quant. Elec. QE. 2:109.

3. Assembly Automation. 1988. pp. 195–96.

4. Bayba, A. J. 1989–1990. Harry Diamond Laboratories Report. Nos. 1–17.

5. Bredzs, N., and C. C. Tennenhouse. 1970. Welding J.: Welding Research Supplement, pp. 86–90.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type;Applied Surface Science;2024-09

2. The effect of solvents on thermal stability of solder pastes in reflow process;Journal of Materials Science;2023-01-18

3. Emerging Solder Technologies;Materials Technology;1994-01

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