Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper-Reference-Cited by-同舟云学术

Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper

Published:2012-07-27 Issue: Volume: Page:123-140
ISSN:
Container-title:Advanced Thermal Management Materials
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Author:

Jiang Guosheng,Diao Liyong,Kuang Ken

Publisher

Springer New York

Link

http://link.springer.com/content/pdf/10.1007/978-1-4614-1963-1_9.pdf

Reference13 articles.

1. Yuen A Telecom packaging improves reliability of high-power lasers. Laser Focus World, Semiconductor Resources. ( www.coherent.com )

2. Bhatia R (2003) Materials issues and engineering design considerations for device packaging of high power edge emitting semiconductor laser arrays and monolithic stacked laser diode bars. Department of Chemical & Materials Engineering, San Jose State University, California

3. Liu X, Zhao W (2009) Technology trend and challenges in high power semiconductor laser packaging. State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, China

4. Wang J, Yuan Z et al (2009) Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity. State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, China

5. Sepulveda JL, Valenzuela L et al (2000) Copper/tungsten mounts keep diode lasers cool. Optoelectron Packaging, Telecom Products Division, Opto Power Corp

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