1. E. Centegen, Force Fed Microchannel High Heat Flux Cooling Utilizing Microgrooved Surfaces. Ph.D Thesis, University Of Maryland, 2010
2. ARC Advisory Group, Enabling Predictive Reliability and Energy Efficiency for Today’s Data Centers, Report to ABB Inc. Data Center Enterprise Management | Decathlon™, Oct 2011
3. A. Shooshtari, R. Mandel, and M. Ohadi, in Cooling of Next Generation Electronics for Diverse Applications, ed. by S. Anwar. Encyclopedia of Energy Engineering and Technology (Taylor and Francis, New York, 2012) (In Press)
4. S. Borkar, Next Generation Materials, Devices or Packages—Year 2025, InterPACK’11 Panel Session, Portland, OR, 7 Jul 2011
5. A. Bar-Cohen, Gen-3 Thermal management technology: role of microchannels and nanostructures in an embedded cooling paradigm. ASME JNEM (In press)