Reliability Studies in the Real World

Author:

Roesch William J.

Publisher

Springer New York

Reference54 articles.

1. G. Moore, Cramming more components onto integrated circuits, Electron. Mag., 38(8), 19 (Apr 1965)

2. H. Stork, Reliability challenges for sub-100nm system on chip technologies, keynote address, in International Reliability Physics Symposium, Phoenix, Arizona (IRPS), 2004

3. E. Deming, in Out of the Crisis, Massachusetts Institute of Technology, Center for Advanced Engineering Study, 1986

4. W. Roesch, T. Rubalcava, C. Hanson, Lifetesting GaAs MMICs under RF stimulus. IEEE Trans. Microw. Theory. Tech. 40(12), 2452–2460 (1992)

5. Y.C. Chou et al., On the investigation of gate metal interdiffusion in GaAs HEMTs, in GaAs IC Symposium, San Diego, California pp. 63–66, 2003

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