A study on μBGA solder joints reliability using lead-free solder materials

Author:

Shin Young-Eui,Lee Jun Hwan,Koh Young-Wook,Lee Chong-Won,Yun Jun Ho,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering

Reference15 articles.

1. Amagai, M., 1999, “Characterization of Chip Scale Packaging Materials,”Microelectronics & Reliability, Vol. 39, pp. 1365–1377.

2. Coffin, L. F., Jr. and Schenectady. N. Y., 1954, “A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal,”Transactions of the ASME. Vol. 76, pp. 932–950.

3. Engelmeier, W., 1983, “Fatigue Life of Lead- less Chip Carrier Solder Joints During Power Cycling,”IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol CHMT-6, No. 3, pp. 232–237.

4. Habu, K., 1999, “Development of New Pb-free Solder Alloy of Sn-Ag-Bi System,”Proceeding of the 1999 IEEE International Symposium on Electronics and the Environment, pp. 21–24.

5. Kariya, Y., Kagawa, H. and Otsuka, M., 1998, “Effect of Strain Rate, Hold Time and Third Element on the Fatigue Damage of Sn-3.5mass Ag Alloy,”Microjoining and Assembly Technology in Electronics 98, pp. 259–264.

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis;Welding in the World;2024-03-11

2. Electronic Packaging: Solder Mounting Technologies;Reference Module in Materials Science and Materials Engineering;2016

3. Reliability behavior of lead-free solder joints in electronic components;Journal of Materials Science: Materials in Electronics;2012-04-19

4. Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages;Microelectronics Reliability;2010-12

5. Reliability of Sn-3.5Ag solder joints in high temperature packaging applications;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3