Reliability of Sn-3.5Ag solder joints in high temperature packaging applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490717.pdf?arnumber=5490717
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics;The Journal of Strain Analysis for Engineering Design;2023-07-31
2. Feasibility Evaluation of Creep Model for Failure Assessment of Solder Joint Reliability of Wafer-Level Packaging;IEEE Transactions on Device and Materials Reliability;2017-12
3. Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling;IEEE Transactions on Power Electronics;2015-05
4. Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling;Computational Materials Science;2012-12
5. Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations;Microelectronics Reliability;2012-11
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