Funder
National Research Foundation of Korea
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Drevin-Bazin, A., Lacroix, F., Barbot, J.F.: SiC die attach for high-temperature applications. J. Electron. Mater. 43, 695–701 (2014)
2. Traeger, R.K., Lysne, P.C., Trans, I.E.E.E.: High temperature electronics application in well logging. Nucl. Sci. 35, 852–854 (1988)
3. Son, J.H., Kim, M.K., Yu, D.Y., Ko, Y.H., Yoon, J.W., Lee, C.W., Park, Y.B., Bang, J.H.: Thermal aging characteristics of Sn-xSb solder for automotive power module. J. Weld. Join. 35, 38–47 (2017)
4. Hong, W.S., Oh, C.M.: Degradation behavior of solder joint and implementation technology for lead-free automotive electronics. J. Korean Weld. Join. Soc. 31, 22–30 (2013)
5. Zhang, H., Minter, J., Lee, N.C.: A brief review on high-temperature, Pb-free die-attach materials. J. Electron. Mater. 48, 201–210 (2019)
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献