Comparison of Plasma Effect on Dewetting Kinetics of Sn Films Between Grounded and Floating Substrates-Reference-Cited by-同舟云学术

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Comparison of Plasma Effect on Dewetting Kinetics of Sn Films Between Grounded and Floating Substrates

Published:2019-11-23 Issue:1 Volume:16 Page:72-80
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Park Soon-won,Jang Gil-su,Kim Kun-su,Hwang Nong-moon

Funder

National Research Foundation of Korea

Global Frontier Hybrid Interface Materials

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s13391-019-00190-3.pdf

Reference20 articles.

1. Thompson, C.V.: Solid-state dewetting of thin films. Annu. Rev. Mater. Res. 42, 399–434 (2012). https://doi.org/10.1146/annurev-matsci-070511-155048

2. Niekiel, F., Schweizer, P., Kraschewski, S.M., Butz, B., Spiecker, E.: The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy. Acta Mater. 90, 118–132 (2015)

3. Kwon, J.-Y., Yoon, T.-S., Kim, K.-B., Min, S.-H.: Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide. J. Appl. Phys. 93, 3270–3278 (2003)

4. Sieradzki, K., Bailey, K., Alford, T.: Agglomeration and percolation conductivity. Appl. Phys. Lett. 79, 3401–3403 (2001)

5. Kwon, S.-H., Choe, H.J., Lee, H.-C., Chung, C.-W., Lee, J.-J.: Mechanism of solid-state plasma-induced dewetting for formation of copper and gold nanoparticles. J. Nanosci. Nanotechnol. 13, 6109–6114 (2013)

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