Author:
Suhir Ephraim,Shakouri Ali
Reference23 articles.
1. Lang GA et al (1970) Thermal fatigue in silicon power devices. IEEE Trans Electron Dev 17:787–793
2. Lau JH (ed) (1993) Thermal stress and strain in microelectronics packaging. Van-Nostrand Reinhold, New York
3. Zeyfang R (1971) Stresses and strains in a plate bonded to a substrate: semiconductor devices. Solid State Electron 14:1035–1039
4. Suhir E (2009) Thermal stress in a bi-material assembly with a “piecewise-continuous” bonding layer: theorem of three axial forces. J Appl Phys D 42:27–31
5. Suhir E (2009) On a paradoxical situation related to bonded joints: could stiffer mid-portions of a compliant attachment result in lower thermal stress? JASME J Solid Mech Mater Eng 3(7):313–330