Dissolution of Cu into Sn-based solders during reflow soldering-Reference-Cited by-同舟云学术

Dissolution of Cu into Sn-based solders during reflow soldering

Published:2003-12 Issue:6 Volume:9 Page:577-581
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Lee Jong-Hyun,Shin Dong-Hyuk,Kim Yong-Seog

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF03027258.pdf

Reference11 articles.

1. M. Schaefer, W. Laub, R. A. Fournelle, and J. Liang,Design & Reliability of Solders and Solder Interconnections (eds., R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw, and W. L. Winterbottom), p. 247, TMS, Warrendale, PA (1997).

2. W. J. Boettinger, C. A. Handwerker, and U. R. Kattner,The Mechanics of Solder Alloy Wetting and Spreading (eds., F. G. Yost, F. M. Hosking, and D. R. Frear), Van Nostrand Reinhold, New York (1993).

3. K.N. Tu and K. Jeng,Mater. Sci. Eng. R 34, 1 (2001).

4. S. Chada, W. Laub, R. A. Fournelle, and D. Shangguan,J. Electron. Mater. 28, 1194 (1999).

5. C. Chada, R. A. Fournelle, W. Laub, and D. Shangguan,J. Electron. Mater. 29, 1214 (2000).

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