Silicon Technologies for Nanoscale Device Packaging-Reference-Cited by-同舟云学术

Silicon Technologies for Nanoscale Device Packaging

Published:2015 Issue: Volume: Page:113-135
ISSN:2193-9691
Container-title:Nanopackaging: From Nanomaterials to the Atomic Scale
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Author:

Thuaire Aurélie,Le Gac Gaëlle,Audoit Guillaume,Aussenac François,Rauer Caroline,Rolland Emmanuel,Hartmann Jean-Michel,Charvet Anne-Marie,Moriceau Hubert,Rivallin Pierrette,Reynaud Patrick,Cheramy Severine,Sillon Nicolas,Baillin Xavier

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-21194-7_8

Reference26 articles.

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4. Lau, J.H: Evolution, challenge, and outlook of TSV (through-silicon via) and 3D IC/Si integration. In: Proceedings of 2011 International Symposium on Advanced Packaging Materials (APM), pp. 462–488 (2011)

5. Gupta, A., Kannan, K., Kim, B., Mohammed, E., Ahn, B.: Development of novel carbon nanotube TSV technology. In: 2010 Electronic Components and Technology Conference, pp. 1699–1702 (2010)

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