Introduction to 3D Microelectronic Packaging-Reference-Cited by-同舟云学术

Introduction to 3D Microelectronic Packaging

Published:2017 Issue: Volume: Page:1-15
ISSN:1437-0387
Container-title:3D Microelectronic Packaging
language:
Short-container-title:

Author:

Li Yan,Goyal Deepak

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-44586-1_1

Reference19 articles.

1. I. Szendiuch, Radioengineering. 20(1), 214 (2011)

2. S.F. Al-sarawi, D. Abbott, P.D. Franzon, IEEE Trans. Comp. Packag. Manufact. Technol. 21(1), 2 (1998)

3. J.Q. Lu, Proc. IEEE 97(1), 18 (2009)

4. J.H. Lau, Chip Scale Rev. 18(1), 32 (2014)

5. L. Li, P. Chia, P. Ton, M. Nagar, S. Patil, J. Xue, J. DeLaCruz, M. Voicu, J. Hellings, B. Isaacson, M. Coor, R. Havens, in Conference Proceedings from the 66th Electronic Components and Technology Conference. (ECTC), Las Vegas, 31 May–3 June 2016, p. 1445

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 3-D Vision and Intelligent Online Inspection in SMT Microelectronic Packaging: A Review;IEEE Journal of Emerging and Selected Topics in Industrial Electronics;2024-04

2. Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging;Journal of Materials Research and Technology;2024-01

3. Role of Cu/SiO₂ Rough Interface in TSV for High-Power Device Under Electromigration;IEEE Transactions on Electron Devices;2023-10

4. Towards Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogeneous Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying;Journal of Electronic Materials;2022-12-25