A Method to Evaluate Creep Properties of Solder Alloys Using Micro Indentation
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-19440-0_15
Reference32 articles.
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1. Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging;Journal of Electronic Packaging;2023-07-21
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