Microstructural evolution at the bonding interface during the early-stage infrared active brazing of alumina-Reference-Cited by-同舟云学术

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Microstructural evolution at the bonding interface during the early-stage infrared active brazing of alumina

Published:2000-10 Issue:10 Volume:31 Page:2527-2536
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Shiue R. K.,Wu S. K.,O J. M.,Wang J. Y.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-000-0197-9.pdf

Reference48 articles.

1. E. Lugscheider and W. Tillmann: Mater. Manufacturing Processes, 1993, vol. 8, pp. 219–38.

2. G. Humpston and D.M. Jacobson: Principles of Soldering and Brazing, ASM INTERNATIONAL, Materials Park, OH, 1993, pp. 111–18.

3. M.M. Schwartz: Brazing, ASM INTERNATIONAL, Materials Park, OH, 1987, pp. 116–25.

4. M.M. Schwartz: Ceramic Joining, ASM INTERNATIONAL, Materials Park, OH, 1989, pp. 75–139.

5. A.P. Xian: J. Mater. Sci., 1993, vol. 28, pp. 1019–30.

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