Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar

Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar–O2 Mixed Gas

Published:2024-04-16 Issue:7 Volume:55 Page:2264-2281
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall Mater Trans A

Author:

Ueshima Yoshiyuki,Hasegawa Masakatsu,Kubota Naoyoshi,Matamura Yuya,Matsubara Eiichiro,Seki Kazuaki,Hirato Tetsuji

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s11661-024-07392-x.pdf

Reference37 articles.

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1. Morphological Stability Limits of Ag–Cu–Al Nanocrystalline Thin Films Prepared via Reactive Sputtering in Ar–O2 Mixed Gas;Metallurgical and Materials Transactions A;2024-06-18