Mechanical Strength and Electrical Conductivity of Cu–In Solid Solution Alloy Wires-Reference-Cited by-同舟云学术

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Mechanical Strength and Electrical Conductivity of Cu–In Solid Solution Alloy Wires

Published:2022-12-28 Issue:3 Volume:54 Page:928-938
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall Mater Trans A

Author:

Abe Yasunori,Semboshi Satoshi,Masahashi Naoya,Lim Sung Hwan,Choi Eun-Ae,Han Seung Zeon

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://link.springer.com/content/pdf/10.1007/s11661-022-06938-1.pdf

Reference43 articles.

1. X. Guoliang, W. Qiangsong, M. Xujun, X. Baiqing, and P. Lijun: Mater. Sci. Eng. A, 2012, vol. 558, pp. 326–30.

2. Q. Lei, Z. Li, T. Xiao, Y. Pang, Z.Q. Xiang, W.T. Qiu, and Z. Xiao: Intermetallics, 2013, vol. 42, pp. 77–84.

3. S. Semboshi, Y. Kaneno, T. Takasugi, and N. Masahashi: Metall. Mater. Trans. A, 2018, vol. 49A, pp. 4956–65.

4. S.Z. Han, E.-A. Choi, S.H. Lim, S. Kim, and J. Lee: Prog. Mater. Sci., 2021, vol. 117, p. 100720.

5. S. Semboshi, R. Hariki, T. Shuto, H. Hyodo, Y. Kaneno, and N. Masahsshi: Metall. Mater. Trans. A, 2021, vol. 52A, pp. 4934–45.

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