Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate-Reference-Cited by-同舟云学术

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Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate

Published:2005-11 Issue:11 Volume:36 Page:3019-3029
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Chang Tao-Chih,Wang Moo-Chin,Hon Min-Hsiung

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-005-0074-7.pdf

Reference39 articles.

1. K.S. Subramanian, V.S. Sastri, M. Elboujdaini J.W. Connor, and A.B.C. Davey: Wat. Res., 1995, vol. 29 (8), pp. 1827–36.

2. G. Ghosh: Metall. Mater. Trans. A, 1999, vol. 30A, pp. 1481–94.

3. L.J. Turbini, W.R. Bent, and W.J. Ready: SMTA Int., Chicago, IL, Sept. 2000, Surface Mount Technology Association, Edina, MN, 2000, pp. 20–24.

4. Comprehensive Reviews of Lead in the Environment under TSCA, 56FR, Environmental Protection Agency, Washington, DC, May 13, 1991, pp. 22096–22098.

5. K. Ninmo: SMTA Int., San Jose, CA, Sept. 1999, Surface Mount Technology Association, Edina, MN, 2000, p. 13.

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5. Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy;Materials Science and Engineering: A;2017-07

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