The effects of stress level and grain size on the ambient temperature creep deformation behavior of an alpha Ti-1.6 wt pct V alloy-Reference-Cited by-同舟云学术

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The effects of stress level and grain size on the ambient temperature creep deformation behavior of an alpha Ti-1.6 wt pct V alloy

Published:2005-03 Issue:3 Volume:36 Page:637-644
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Aiyangar A. K.,Neuberger B. W.,Oberson P. G.,Ankem S.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-005-0179-z.pdf

Reference35 articles.

1. H. Adenstedt: Met. Progr., 1949, vol. 56, pp. 658–79.

2. W.A. Wood: Technical Report No. 45, Columbia University, NY, Apr. 1967.

3. W.A. Wood: Technical Report No. 54, Columbia University, NY, Apr. 1968.

4. W.H. Riemann: J. Mater., 1971, vol. 6, pp. 926–33.

5. A.J. Hatch, J.M. Patridge, and R.G. Broadwell: J. Mater., 1967, vol. 2, pp. 111–21.

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