An Experimental Study of Transient Liquid Phase Bonding of the Ternary Ag-Au-Cu System Using Differential Scanning Calorimetry-Reference-Cited by-同舟云学术

An Experimental Study of Transient Liquid Phase Bonding of the Ternary Ag-Au-Cu System Using Differential Scanning Calorimetry

Published:2013-03-27 Issue:8 Volume:44 Page:3708-3720
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Kuntz M. L.,Panton B.,Wasiur-Rahman S.,Zhou Y.,Corbin S. F.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-013-1704-0.pdf

Reference34 articles.

1. D. Duvall, W. Owczarski and D. Paulonis, Weld. J., vol. 53, pp. 203-214, 1974.

2. G. Cook and C. Sorensen, J Mater Sci, vol. 46, pp. 5305-5323, 2011.

3. T. Eager and W. Baeslack: Encyclopedia of Advanced Materials, D. Bloor, M. Flemings, R. Brook and S. Mahajan, eds., Pergamon Press, Oxford, 1994, pp. 1221–25.

4. L. Connor, ed.: Welding Handbook, 8 ed., vol. 1, American Welding Society, Miami, FL, 1989.

5. Y. Zhou, W. Gale and T. North, Int. mater. rev., vol. 40, no. 5, pp. 181-196, 1995.

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Kinetics of initial diffusion solidification during continuous heating in term of IN718 superalloy / 316LN steel TLP bonding system;Materialia;2024-05

2. The composition effect on the structural and thermodynamic properties of Cu–Ag–Au ternary nanoalloys: a study via molecular dynamics approach;Modelling and Simulation in Materials Science and Engineering;2024-03-22

3. Kinetics of Initial Diffusion Solidification During Continuous Heating in Term of IN718 Superalloy / 316LN Steel TLP Bonding System;2024

4. Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process;Journal of Materials Science: Materials in Electronics;2023-01

5. A new numerical model for simulating transient liquid phase (TLP) bonding of dissimilar materials involving 1D, 2D and 3D solid–liquid interface migration;Philosophical Magazine;2022-07-25