A new numerical model for simulating transient liquid phase (TLP) bonding of dissimilar materials involving 1D, 2D and 3D solid–liquid interface migration-Reference-Cited by-同舟云学术

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A new numerical model for simulating transient liquid phase (TLP) bonding of dissimilar materials involving 1D, 2D and 3D solid–liquid interface migration

Published:2022-07-25 Issue:21 Volume:102 Page:2185-2206
ISSN:1478-6435
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Afolabi Oluwadara C.¹,Ojo Olanrewaju A.¹

Affiliation:

1. Department of Mechanical Engineering, University of Manitoba, Winnipeg, Canada

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786435.2022.2102261

Reference43 articles.

1. Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

2. Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system

3. A diffusional model for transient liquid phase bonding

4. Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

5. Powder interlayer bonding of titanium alloys: Ti-6Al-2Sn-4Zr-6Mo and Ti-6Al-4V

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