Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Author:

Vianco Paul T.,Rejent Jerome A.,Zender Gary L.,Hlava Paul F.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference24 articles.

1. P.T. Vianco: Circ. World, 25, pp. 6–24 (1998).

2. The State of the Art in Pb-Free Soldering Technology, 2nd ed., P. Vianco, ed., Surface Mount Technology Association, Edina, MN, 2004, CD-ROM.

3. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson: Proc. 48th Elect. Comp. Technol. Conf., IEEE, New York, NY, 1998, pp. 952–61.

4. Z. Mei, P. Johnson, M. Kaufmann, and A. Eslambolchi: Proc. 49th Elect. Comp. Technol. Conf., IEEE, New York, NY, 1999, pp. 125–34.

5. M. Arra, D. Shangguan, and D. Xie: Proc. APEX 2003, IPC, Northbrook, IL, 2003, pp. S12-2-1–S12-2-7.

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