Interface Development in Cu-Based Structures Transient Liquid Phase (TLP) Bonded with Thin Al Foil Intermediate Layers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11661-014-2339-5.pdf
Reference36 articles.
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