Author:
Cao D. M.,Jiang J.,Meng W. J.,Jiang J. C.,Wang W.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference16 articles.
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5. Cao DM, Meng WJ, Kelly KW (2004) High-temperature instrumented microscale compression molding of Pb. Microsyst Technol 10:323
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