Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging-Reference-Cited by-同舟云学术

Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging

Published:2015-02-18 Issue:5 Volume:46 Page:2051-2062
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Roh Myong-Hoon,Sharma Ashutosh,Lee Jun-Hyeong,Jung Jae-Pil

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-015-2801-z.pdf

Reference57 articles.

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