Author:
Hoyer Marko,Helms Domenik,Nebel Wolfgang
Publisher
Springer Berlin Heidelberg
Reference11 articles.
1. Technology Working Groups. ITRS-Process Integration, Devices and Structures.
http://www.itrs.net/Links/2005ITRS/PIDS2005.pdf
2. Hu, C.: Bsim model for circuit design using advanced technologies. In: Symposium on VLSl Circuits Digest of Technical Papers, 2001, pp. 5–6 (2001)
3. Keshavarzi, A., Tschanz, J., Narendra, S., De, V., Daasch, W., Roy, K., Sachdev, M., Hawkins, C.: Leakage and Process Variation Effects in Current Testing on FutureCMOS Circuits. IEEE Design & Test of Computers 19, 36–43 (2002)
4. Tschanz, J., Kao, J., Narendra, S., Nair, R., Antoniadis, D., Chandrakasan, A., De, V.: Adaptive Body Bias For Reducing Impacts of Die-To-Die and Within-Die Parameter Variations on Microprocessor Frequency and Leakage. IEEE Journal of Solid-State Circuits 37, 1396–1402 (2002)
5. Meijer, M., Pessolano, F., de Gyvez, J.P.: Technology Exploration for Adaptive Power and Frequency Scaling in 90nm CMOS. In: ISLPED 2004 (2004)
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