1. “EIAJ ED-4701 Semiconductor device environment and durability testing methods” (1994) Electronic industries association of Japan
2. “European power supply manufacturers association”, MTBF Report, June 2005
3. Analysis of thermal failure of electronic components, MPE 635, Electronic cooling, Cairo University, Egypt, 2007
4. Chary Geetha V, Habtour Ed, Drake Gary S (2012) Improving the reliability in the next generation of US Army platforms through physics of failure analysis. J Fail Anal Prev 2(1):74–85
5. Lloyd W Condra (2001) Reliability improvement with design of experiments, 2nd edn, Marcel Dekker, New York