Chemical Mechanical Polishing for SiO2 Film Using Polystyrene@ceria (PS@CeO2) Core–Shell Nanocomposites
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics
Link
http://link.springer.com/content/pdf/10.1007/s10904-015-0253-y.pdf
Reference21 articles.
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2. H. Deng, K. Hosoya, Y. Imanishi, K. Endo, K. Yamamura, Electro-chemical mechanical polishing of single-crystal SiC using CeO2 slurry. Electrochem. Commun. 52, 5–8 (2015)
3. S. Armini, C.M. Whelan, K. Maex, Engineering polymer core–silica shell size in the composite abrasives for CMP applications. Electrochem. Solid State Lett. 11, H280–H284 (2008)
4. S. Armini, J. De Messemaeker, C.M. Whelan, M. Moinpour, K. Maex, Composite polymer core-ceria shell abrasive particles during oxide CMP: a defectivity study. J. Electrochem. Soc. 155, H653–H660 (2008)
5. Y. Chen, Z. Li, N. Miao, Polymethylmethacrylate (PMMA)/CeO2 hybrid particles for enhanced chemical mechanical polishing performance. Tribol. Int. 82, 211–217 (2015)
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