Author:
Chiang W. K.,Chan Y. C.,Ralph Brian,Holland Andrew
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. R. Haug, U. Behner, C.-P. Czaya, H.-J. Jiang, K. Stefan, S. Reiner, and C.P.O. Treuteler, IEEE Trans. Electron. Packaging 23, 12 (2000).
2. H. Kristiansen and J. Liu, IEEE Trans. Compon. Packaging, Part A 21, 208 (1998).
3. S. Liong, C.P. Wong, and W.F. Burgoyne, IEEE Trans. Compon. Packaging Technol. 28, 327 (2005).
4. D. Klosterman, L. Li, and J.E. Morris, IEEE Trans. Compon. Packaging, Part A 21, 23 (1998).
5. S.H. Mannan, D.C. Whalley, A.O. Ogunjimi, and D.J. Williams, International Symposium on Electronic Manufacturing Technology (Piscataway, NJ: IEEE, 1995), pp. 142–145.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献