Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding-Reference-Cited by-同舟云学术

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Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Published:2000-01 Issue:1 Volume:23 Page:12-18
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Haug R.,Behner R.,Czaya C.-P.,Hongquan Jiang ,Kotthaus S.F.,Schuetz R.,Treutler C.P.O.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/17958/00827521.pdf?arnumber=827521

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing;Applied Surface Science;2009-07

2. Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications;Journal of Electronic Materials;2006-03

3. A Novel Joint-in-Via Flip-Chip Chip-Scale Package;IEEE Transactions on Advanced Packaging;2006-02

4. Electrical noise as a reliability indicator in electronic devices and components;IEE Proceedings - Circuits, Devices and Systems;2002-02-01

5. A novel joint-in-via, flip-chip chip-scale package;2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

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