Electronic Packaging Applications

Author:

Suhling Jeffrey C.,Lall Pradeep

Publisher

Springer US

Reference76 articles.

1. D.R. Seraphim, R. Lasky, C.Y. Li: Principles of Electronic Packaging (McGraw-Hill, New York 1989)

2. R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein: Microelectronics Packaging Handbook, Parts 1–3 (Chapman Hall, New York 1997)

3. J.W. Dally, P. Lall, J.C. Suhling: Mechanical Design of Electronic Systems (College House Enterprises, Knoxville 2008)

4. S.H. Ong, S.H. Tan, K.T. Tan: Acoustic microscopy reveals IC packaging hidden defects, Proc. 1997 Electronic Packaging Technology Conference (IEEE, 1997) pp. 297–300

5. S. Canumalla: Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer Selection, IEEE Trans. Compon. Packag. Technol. 22(4), 582–592 (1999)

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