Author:
Lee Chin C.,Wang Pin J.,Kim Jong S.
Reference79 articles.
1. Luo S, Wong C (2001) Fundamental study on moisture absorption in epoxy for electronic application. Int Symp Adv Packag Mater, pp 293–298
2. Teh P, Mariatti M, Beh K et al (2007) The properties of epoxy resin coated silica fillers composites. Mater Lett 61:2156–2158
3. Chiu C, Lin J, Hsu K et al (2003) Thermally cleavable epoxy resins for electronic and optoelectronic applications. IEEE Electron Packag Technol Conf, pp 425–428
4. Cognard P, editor (2005) Adhesives and Sealants: Basic concepts and high tech bonding. Elsevier Ltd, Oxford
5. Watanabe T, Ooba N, Imamura S et al (1998) Polymeric optical waveguide circuits formed using silicone resin. J Lightwave Technol 16:1049–1055
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